Method and apparatus for wafer-level testing of semiconductor laser
US6775000B2 · kind B2 · utility
4Cited by
8References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2001 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Jan 20, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0201
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system and method for manufacturing and wafer-level testing properties of a wafer comprises a chuck receiving a wafer to be tested and a pump light source directing an output beam toward selected locations on a wafer received on the chuck in combination with a laser light detector detecting light emitted from the wafer and a pump beam aiming mechanism selectively varying a position at which the pump light source output beam enters the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.