Bonding wire inductor
US6775901B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2001 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Feb 14, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A vertical bonding wire inductor having a high quality (Q) factor and tunability, which can be manufactured using an existing wire bonding technology which is widely used for packaging integrated circuits, without an additional mask manufacturing process. The vertical bonding wire inductor includes at least one pair of bonding pads (3) occupying a predetermined area on a substrate (9) and one or more bonding wires (1) for connecting one or more pairs of bonding pads (3). The bonding wire (1) has a loop shape having a predetermined height. Due to the improved electrical characteristics, stability in process, tunability without an additional mask manufacturing process, and relatively low manufacturing cost, the vertical bonding wire inductor can be useful in production of economical microwaves devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.