Spacecraft radiator system using crossing heat pipes
US6776220B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 1999 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Oct 31, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB64G1/506
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
Heat dissipating apparatus for use in dissipating heat produced by electronic components of a spacecraft. The heat dissipating apparatus comprises first and second radiator panels each having an outer panel faceskin 18 and inner panel faceskin. A heat pipe matrix is disposed between outer and inner panel faceskins of each radiator panel, and a honeycomb core is disposed between the inner and outer panel faceskins that surrounds the heat pipe matrix. A transverse panel interconnects the first and second radiator panels. A plurality of crossing heat pipes extend between and thermally couple to the heat pipe matrices of the first and second radiator panels. The plurality of crossing heat pipes extend outside the plane of the transverse panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.