High-accuracy placement method utilizing double pick and place
US6776327B2 · kind B2 · utility
2Cited by
14References
48Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2002 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Feb 28, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method is provided for placement of a first workpiece onto a second workpiece. The first workpiece is initially positioned at an origination location and the second workpiece has an attach location different from the origination location. A first place step is performed to displace the first workpiece from the origination location to an intermediate location different from the origination and attach locations. A second place step is performed to displace the first workpiece from the intermediate location to the attach location and the first workpiece is attached to the second workpiece at the attach location.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.