Hydrogen fluxless soldering by electron attachment
US6776330B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2001 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Nov 26, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/206
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of dry fluxing metal surfaces of one or more components to be soldered, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the target assembly; c) providing a gas mixture comprising a reducing gas between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes and donating electrons to the reducing gas to form negatively charged ionic reducing gas; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.