Bead curing finger mold
US6776603B1 · kind B1 · utility
0Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2001 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Nov 15, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29D30/48
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A tire bundle is molded in a mold cavity formed by closing a mold having upper and lower mold halves with intermeshing fingers (20, 24) for enclosing bead wires and providing a molded bead ring for placing in a bead apex mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.