Ground lead with integrated bushing apparatus and method
US6776628B2 · kind B2 · utility
3Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2002 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Dec 19, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/16
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A grounding device comprising a ground lead and a support bushing wherein the ground lead and the support bushing comprise a unitary structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.