Substrate and method of forming substrate for fluid ejection device
US6776916B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 1, 2002 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Jun 16, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1631
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of forming an opening through a substrate includes etching a first portion of the opening into the substrate from a first side, etching a plurality of second portions of the opening into the substrate from a second side opposite the first side, continued etching of at least one of the first portion and the plurality of second portions of the opening to the other of the first portion and the plurality of second portions of the opening, and overetching each of the second portions of the opening at an interface between the first portion and each of the second portions of the opening, including communicating each of the second portions with an adjacent one of the second portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.