Patent · US Expired

Recycle methods for water based powder injection molding compounds

US6776954B1 · kind B1 · utility

1Cited by
8References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 31, 2000
Grant dateAug 17, 2004
Priority date
Expiry dateNov 26, 2021

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P10/20
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A process for adjusting the level of water or water soluble additives in aqueous-based powder injection molding compounds for the purpose of recycling scrap material, controlling shrinkage or rehydrating dry feedstock. Depending on the objective, the process may require material granulation equipment, equipment for the addition or removal of water and mixing equipment. The molding compounds may be comprised of either recycled scrap material before being heat-treated or dry, virgin feedstock material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.