Puncture resistant, high shrink films, blends, and process
US6777046B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 1999 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Nov 1, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31928
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A polymer blend and mono-and multilayer films made therefrom having an improved combination of properties such as high shrinkage values and high puncture resistance wherein the blend has a first copolymer of ethylene and octene-1 having a copolymer melting point of from 55 to 95° C., preferably of from 80 to 92° C.; a second copolymer of ethylene and at least a &agr;-olefin having a copolymer melting point of from 115 to 128° C.; and a third copolymer of ethylene and a vinyl ester or alkyl acrylate and having a melting point of from 60 to 110° C., and a process for making such films, which preferably have at least 45% shrinkage at 90° C. in at least one direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.