Patent · US Expired

Systems, apparatus and methods for bonding and/or sealing electrochemical cell elements and assemblies

US6777127B2 · kind B2 · utility

13Cited by

25References

36Claims

0Family size

Assignee

BALLARD POWER SYSTEMS INC. · US

Inventors

Johann Einhart · Überlingen, DE
Stefan Reiff · Tauberbischofsheim, DE
Rudolf Bindel · Waiblingen, DE
Hubert Ryssel · Eßlingen, DE
Christopher Todd Kirby · Burlington, CA
Francisco Diaz · North Vancouver, CA
Michael Medina · Vancouver, CA

Key dates

Filing date	Jun 22, 2001
Grant date	Aug 17, 2004
Priority date	—
Expiry date	Jul 18, 2022

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49114
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

Apparatus, systems, and methods for bonding one element of an electrochemical cell or cell stack to another wherein a sealing grove with a complex cross-sectional shape receives and retains a bead of adhesive prior to being assembled. The complex cross-sectional shape has a raised portion sized to receive and retain the bead of adhesive, and at least one depressed portion to receive adhesive displaced from the raised portion during assembly. Embodiments of the invention incorporate raised portions with straight, beveled, curved, and rough surfaces to increase the strength of the bond between the respective elements.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.