Film deposition to enhance sealing yield of microcap wafer-level package with vias

US6777263B1 · kind B1 · utility

Assignee

• AGILENT TECHNOLOGIES, INC. · US

Inventors

• Qing-Cao Gan · Nanhu, CN
• Richard C. Ruby · Menlo Park, US
• Frank S. Geefay · Cupertino, US
• Andrew Thomas Barfknecht · Menlo Park, US

Key dates

• Filing date: Aug 21, 2003
• Grant date: Aug 17, 2004
• Expiry date: Aug 21, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/50
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A method for forming a wafer package includes forming a die structure, wherein the die structure includes a first wafer, a device mounted on the first wafer, a second wafer mounted atop the first wafer with a first seal ring around the device and a second seal ring around a via contact. The method further includes forming a trench in the second wafer around the first seal ring, filling the trench and the via contact with a sealing agent, patterning a topside of the second wafer to removed the excessive sealing agent and to expose a contact pad of the via contact, and singulating a die around the first seal ring.