Thick wafer processing and resultant products
US6777311B2 · kind B2 · utility
3Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2002 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Mar 5, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1052
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A thick wafer is diced by partially dicing a first side to form a first dice, flipping the wafer so that the first side is now in contact with a dicing tape, and dicing a second side. The dicing of the second side may be achieved by aligning a dicing tool to the first dice and/or alignment marks on the wafer. The thick wafer may be a composite wafer including two or more wafers bonded together. These two wafers may be different thicknesses and/or different materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.