Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby
US6777767B2 · kind B2 · utility
157Cited by
29References
40Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 29, 2000 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Nov 29, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16235
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A crystalline substrate based device includes a crystalline substrate having formed thereon a microstructure, and a transparent packaging layer which is sealed over the microstructure by an adhesive and defines therewith at least one gap between the crystalline substrate and the packaging layer. The microstructure receives light via the transparent packaging layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.