Stacked semiconductor device and method of producing the same
US6777799B2 · kind B2 · utility
47Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2003 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Jul 22, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on the first semiconductor chip by flip-chip bonding. A second semiconductor chip is secured onto the printed circuit board. The second semiconductor chip is connected to the flexible printed wiring board by wire bonding. The first semiconductor chip is connected to the flexible printed wiring board by wire bonding via the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.