Ceramic package for crystal oscillator
US6777858B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2003 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Apr 16, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/1021
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Disclosed is a ceramic package mounted with a crystal oscillator. The structure of the ceramic package is improved in order to reduce its size while minimizing thermal influence to a crystal wafer mounted on the ceramic package. The crystal oscillator ceramic package has a bottom sheet, a buffer sheet disposed on a periphery of the bottom sheet and having internal terminals on a top thereof, a crystal wafer mounted on the buffer sheet, a supporting sheet formed on a periphery of the buffer sheet and spaced from the internal terminal on the buffer sheet at a designated interval and a lib covering the supporting sheet for sealing a portion of the ceramic package for receiving the crystal wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.