Device for specific particle manipulation and deposition
US6777880B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 31, 2003 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Mar 31, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32366
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process for manipulating particles distributed substantially non-uniformly in a plasma of a carrier or reaction gas, wherein Coulomb interaction between the particles is so low that the particles substantially do not form a plasmacrystalline state, and the particles are exposed in a location-selective manner to external adjustment forces and/or the plasma conditions are subjected to a location-selective change to apply at least a portion of the particles onto a substrate surface mask-free and/or subject it to a location-selective plasma treatment in the carrier or reaction gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.