Patent · US Expired

Means for handling high-frequency energy

US6778037B1 · kind B1 · utility

12Cited by
3References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 2, 2002
Grant dateAug 17, 2004
Priority date
Expiry dateApr 2, 2022

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01P5/16
  • WIPO fieldTelecommunications
  • WIPO sectorElectrical engineering

Abstract

The invention relates to structures, by which part of the incoming high-frequency energy can be separated to its own path (out1) or energies coming from different paths can be combined to a common path. The basic idea of the invention is that all components of the dividing or combining means are integrated into a monolithic structure in an insulating material, preferably multilayer ceramics. The transmission line strips (311) and other conductors are formed by printing conductive material on the outer surface of the ceramic piece (301) and in its interlayers, when required. The conductors between the surfaces are formed by filling the hole made through the layer or layers with conductive material. The resistive components (321) parallel with and between the surfaces are formed in a similar manner. The structure according to the invention is relatively small and reliable, and its manufacturing costs are low.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.