Method for cutting tape carrier packages of a LCD and LCD structure
US6778247B2 · kind B2 · utility
4Cited by
21References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2002 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Aug 23, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cutting method of a tap carrier package of a liquid crystal display. The cutting method cuts a film comprising a first straight layout along a predetermined direction on a wiring layer comprising a second straight layout along the predetermined direction and a oblique layout, the method comprises the following steps. First, a breach is formed by cutting a part of the first straight layout on the film. Finally, the film is fastened on the wiring layer. Thus, the remaining first straight layout is only connected to the straight layout and the oblique layout is exposed through the breach.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.