Water-resistant electronic enclosure having a heat sink
US6778388B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 23, 2001 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Jan 29, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20445
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device and method for enclosing electronics in a waterproof environment and transferring the heat generated by the electronics to an external environment is provided. The device includes a housing and a heat sink. The housing includes top and bottom pieces that are sealed to one another forming an interior portion. The interior portion houses electronic components. A face plate is coupled to the front of the housing and includes an opening that is sealed with a hinged door. A fastening mechanism securely fastens the heat sink to the housing so that a substantial portion of the heat sink is in contact with the back side of housing. Heat sink includes a base and a plurality of fins that are adapted to transfer heat generated by the electronic components within the interior of the housing to an external environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.