Heat dissipation device for electronic component
US6778392B2 · kind B2 · utility
13Cited by
5References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 15, 2003 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Jan 15, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/203
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device is employed to lower the temperature of an electronic component. The dissipation device has a first blower, a second blower, and three heat dissipation fins. The first heat dissipation fin connected to the electronic component via a heat pipe is cooled by the first blower. The second heat, dissipation fin connected to the electronic component via a heat pipe is cooled by the second blower. The third heat dissipation fin closely connected to the electronic component is cooled by the first and second blower serially.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.