Retaining device for heat sink
US6778396B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 16, 2002 |
| Grant date | Aug 17, 2004 |
| Priority date | — |
| Expiry date | Dec 16, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T24/44017
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A retaining device for attaching a heat sink (2) to a CPU (3) mounted on a circuit board (4). The retaining device includes a pair of clips (1), a backplate (6), and four pins (5). Each clip includes a central pressing portion (10), two resilient portions (12) adjacent the pressing portion, two shoulders (13) adjacent the resilient portions, and two arms (17). Each shoulder defines first and second cutouts (14a, 14b). Each pin forms a blocking head (50), and a bottom blocking stop (58). The pins are extended through the backplate, the circuit board and the heat sink. The heads are initially received through the first cutouts, and then engaged on the shoulders at the second cutouts. The heads press downwardly on the clips, and the stops press upwardly on the backplate. Thus, the clips and the backplate firmly sandwich the heat sink, the CPU and the circuit board therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.