Integrated balun and transformer structures
US6779261B2 · kind B2 · utility
4Cited by
2References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 15, 2003 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | Jan 15, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method for producing an on-chip signal transforming device. The method includes providing a substrate, and laying a first conductive layer above the substrate, wherein the first conductive layer has a plurality of interleaved inductors. The method then includes laying a second conductive layer above the substrate, wherein the second conductive layer has at least one inductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.