Flow sensor and method for producing the same
US6779712B2 · kind B2 · utility
6Cited by
17References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2003 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | Apr 3, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49428
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention relates to a flow sensor comprising a substrate with integrated heat source and temperature sensors. Solder bumps are arranged on the heat source and the temperature sensors and the substrate is attached to the outside of a tube using flip chip technology. Preferably, the outside of the tube is structured for being wetted at appropriate positions by the solder. This allows to assemble the sensor easily and accurately.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.