Ejection head for aggressive liquids manufactured by anodic bonding
US6780340B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 26, 2002 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | Nov 30, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing an ejection head (10) or ejector suitable for ejecting in the form of droplets (16) a liquid (14) conveyed inside the ejection head (10), comprising a step of producing, from a silicon wafer, a nozzle plate (12) having at least one ejection nozzle (13); a step of producing, from another silicon wafer, a substrate (11) having at least one actuator (15) for activating the ejection of the droplets of liquid through the nozzle (13); and a step of joining the nozzle plate (12) and the substrate (11) together to form the ejection head, wherein this joining step comprises the production of a junction (25), made by means of the anodic bonding technology, between the substrate (11) and the nozzle plate (12), in such a way that, in the area of this junction (25), the ejection head (10) does not present structural discontinuities, and also possesses a resistance to chemical corrosion by the liquid (14) contained in the ejection head (10) at least equal to that of the silicon constituting both the substrate (11) and the nozzle plate (12). The method of the invention may be applied for manufacturing an ink jet printhead (110), having one or more nozzles (113a, 113b, e…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.