Insulating resin composition and laminate obtained therefrom
US6780502B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2002 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | Oct 2, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31794
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention relates to an insulating resin composition which exhibits high impact resistance and heat resistance and good adhesiveness to the plating metal, is selectively etchable by a permanganate salt commonly used in a plating operation and suited for an insulating layer in multilayer wiring boards. The insulating resin composition is a photo-polymerizable or thermally polymerizable resin composition comprising 3-10 parts by weight of a crosslinked elastic polymer per 100 parts by weight of a resin component (excluding the crosslinked elastic poly and including monomers) and said crosslinked elastic polymer has carboxyl groups and is dispersed with an average secondary particle diameter in the range of 0.5-2 &mgr;m.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.