Polycarbosilane adhesion promoters for low dielectric constant polymeric materials
US6780517B2 · kind B2 · utility
8Cited by
7References
20Claims
0Family size
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Key dates
| Filing date | Jun 4, 2002 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | Jul 17, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The adhesion of low k poly(arylene ether) dielectric coating compositions is effectively enhanced by a polycarbosilane promoter additive or primer. A coating composition is prepared by (a) providing a poly(arylene ether) composition; and (b) adding to said composition a small effective adhesion promoting amount of certain polycarbosilanes. The adhesion enhanced coating compositions are cured by heat treatment at temperatures in excess of 50° C. to form a polycarbosilane-modified poly(arylene ether) polymer composition having a low k dielectric constant for use in semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.