Heater for temperature control integrated in circuit board and method of manufacture
US6781056B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2003 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | Apr 9, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/304
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Circuit boards (1100, 1500, 1600, 1700) and methods for fabricating circuit boards that include heaters for maintaining temperature sensitive components at an operating temperature are provided. Resistive traces (602, 702,704) are included in the circuit boards proximate temperature sensitive apparatus (1004, 1304, 1602, 1712). Thermally conductive patches (802, 902, 904) are interposed between the resistive traces and the temperature sensitive components. The thermally conductive patches establish zones of relatively uniform temperatures. According to a preferred embodiment of the invention the temperature sensitive apparatus comprises a fluid conduit (1004).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.