Method for drilling holes in a substrate

US6781092B2 · kind B2 · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Hubert De Steur · Drongen, BE
• Alexander Kilthau · Bad Schönborn, DE
• Andre Kletti · Sandhausen, DE
• Hans Juergen Mayer · Viernheim, DE
• Petra Mitzinneck · Karlsruhe, DE
• Eddy Roelants · Brugge, BE
• Oliver Thuerk · Graben-Neudorf, DE
• Marc Van Biesen · Gent, BE

Key dates

• Filing date: Feb 21, 2003
• Grant date: Aug 24, 2004
• Expiry date: Feb 21, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/0554
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

When holes are being drilled in an electric circuit substrate, a laser beam is moved on concentric circular tracks in the region of the hole to be drilled. The transition from one circular track to the next takes place in each case on an arc that departs approximately tangentially from the circular track last traversed and nestles approximately tangentially against the circular track newly to be described in such a way that in each case the starting point of a new circular track is offset by a prescribed angle from the starting point of the preceding circular track.