Microelectromechanical system package with environmental and interference shield
US6781231B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 10, 2002 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | Sep 17, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microelectromechanical system package has a microelectromechanical system microphone, a substrate, and a cover. The substrate has a surface for supporting the microelectromechanical microphone. The cover includes a conductive layer having a center portion bounded by a peripheral edge portion. A housing is formed by connecting the peripheral edge portion of the cover to the substrate. The center portion of the cover is spaced from the surface of the substrate to accommodate the microelectromechanical system microphone. The housing includes an acoustic port for allowing an acoustic signal to reach the microelectromechanical system microphone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.