Drop amplifier housing with multiple tiers
US6781457B2 · kind B2 · utility
0Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2002 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | May 31, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/0247
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An amplifier housing assembly is disclosed. The housing assembly includes a first section including a first plurality of holes; and a second section including a second plurality of holes. The first and second sections are interconnected. The first and second sections have a common back wall and a common bottom plate. The first plurality of holes and the second plurality of holes are at two different parallel planes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.