Methods and systems of heat transfer for electronic enclosures
US6781830B2 · kind B2 · utility
21Cited by
73References
97Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2002 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | Nov 5, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20445
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronics enclosure is provided. The enclosure includes a modular card cage adapted to receive one or more electronic circuit cards and a heat sink adapted to protrude through an opening of an enclosure and couple to the modular card cage. The modular card cage and the heat sink provide an isolated heat transfer path for heat, produced by each of the one or more electronic circuit cards, to be removed from the enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.