Diode laser module and application equipment
US6782018B2 · kind B2 · utility
1Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2002 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | Sep 7, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02325
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
This invention is provided to reduce wavefront aberrations caused by the filling of a transparent resin intended to prevent degradation of a diode laser in a hermetically sealed package. A parallel-plane plate is arranged between a diode laser and an objective lens, and a transparent resin is filled into a space formed between the diode laser and the parallel-plane plate. With this invention, degradations of the diode lasers can be prevented and the wavefront aberrations can be reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.