Method and apparatus for fiber array module
US6782183B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2003 |
| Grant date | Aug 24, 2004 |
| Priority date | — |
| Expiry date | Apr 18, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3652
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A fiber array module fabrication method. The method includes the steps of: (a) preparing a optical fiber ribbon, a solder/binder coated fiber array substrate, and two holder bases, one holder base having longitudinally extended locating grooves; (b) putting the fiber array substrate in between the holder bases and keeping the longitudinally extended grooves of the fiber array substrate in alignment with the longitudinally extended aligning grooves of the holder base and then loading the optical fiber ribbon in the holder bases and keeping the optical fibers of the fiber ribbon in the locating grooves of the holder base and the fixing grooves of the fiber array substrate; (c) heating the solder or radiating the binder to fixedly secure the optical fibers to the fiber array substrate and the fiber array cover plate, and (d) cutting off the optical fibers and removing the finished fiber array module from the holder bases.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.