Method of manufacturing a chip PTC thermistor
US6782604B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2000 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Feb 16, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49099
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Chip PTC thermistors that can easily be inspected the soldered portions after it is mounted on a printed circuit board and that can be used in a flow soldering process, and methods of making same. A chip PTC thermistor of the present invention includes: a first main electrode and a first sub-electrode on first surface of a cuboidal form conductive polymer having the PTC characteristics, a second main electrode and a second sub-electrode on a second surface opposite the first surface of the conductive polymer. Between the first sub-electrode and the second sub-electrode, and between the first sub-electrode and the second main electrode are electrically connecting with a first side electrode and a second side electrode, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.