Patent · US Expired

Method of making high contact density electrode array

US6782619B2 · kind B2 · utility

14Cited by
5References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 17, 2001
Grant dateAug 31, 2004
Priority date
Expiry dateAug 17, 2021

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49176
  • WIPO fieldMedical technology
  • WIPO sectorInstruments

Abstract

A laminated multi-electrode biocompatible implant, comprising a first layer of flexible, biocompatible dielectric material having a first, exposed surface. A second layer of flexible biocompatible dielectric material, is adhered to the first layer. Further, a third layer of flexible biocompatible dielectric material is adhered to the second layer. Additionally, a first conductive trace is interposed between the first layer and the second layer and a second conductive trace interposed between said second layer and said third layer. Finally, a first conductor, which breaches said first layer, conductively connects the first conductive trace to the exposed surface of the first layer, thereby forming a first electrode and a second conductor, which breaches the first layer and the second layer, conductively connects the second conductive trace to the exposed surface of the first layer, thereby forming a second electrode.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.