Micromechanical component
US6782749B2 · kind B2 · utility
2Cited by
3References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 27, 2002 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Feb 2, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention creates a micromechanical component, in particular an acceleration sensor, having a flexible spring device (F1, F2, F3) for the spring mounting of a mass (3) over a substrate (4), the flexible spring device (F1, F2, F3) being on the one hand connected with the mass (3) and being on the other hand anchored in the substrate (4). The flexible spring device (F1, F2, F3) has at least one flexible spring element (F2, F3) whose movability in relation to the substrate (4) is capable of being modified in order to modify the effective spring constant of the flexible spring device (F1, F2, F3).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.