Surface-micromachined pressure sensor and high pressure application
US6782755B2 · kind B2 · utility
20Cited by
14References
27Claims
0Family size
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Key dates
| Filing date | Jul 6, 2001 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Jul 6, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0054
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A surface-micromachined high-pressure sensor, formed by forming a cavity using a sacrificial layer. The sacrificial layer can be reflowed to make the edges of the cavity more rounded. The material that is used for the diaphragm can be silicon nitride, or multiple layers including silicon nitride and other materials. The pressure sensor is intended to be used in high pressure applications, e.g. pressure is higher than 6000, 10,000 or 30,000 P.S.I.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.