Patent · US Expired

Micromechanical component and equalization method

US6782756B2 · kind B2 · utility

1Cited by
6References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 9, 2003
Grant dateAug 31, 2004
Priority date
Expiry dateJan 15, 2023

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01L9/0054
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A micromechanical component, in particular a pressure sensor, including a substrate that has a membrane region, a surrounding region of the membrane region, at least one measuring resistance provided in the membrane region and modifiable by deformation of the membrane region, and a corresponding evaluation circuit provided in the surrounding region. An interference effect on the measuring resistance is producible by way of a deformation of parts, in particular conductor paths, of the evaluation circuit relative to the substrate. The invention also creates a corresponding equalization method on a test chip or as an individual final equalization.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.