Cutting device for breaking fragile materials such as semiconductor wafers or the like
US6782883B2 · kind B2 · utility
4Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2003 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Feb 5, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/929
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A cutting device for breaking fragile materials is constructed to include a lifting mechanism adapted to move the cutter vertically, a rotary table adapted to control the cutting angle of the cutter on the workpiece, a feed mechanism adapted to control the federate of the cutter, and a rotary mechanism adapted to rotate the cutter for enabling the cutter to cut the workpiece with one of multiple cutting points thereof selectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.