In situ molded thermal barriers
US6783345B2 · kind B2 · utility
110Cited by
71References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 2002 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Jul 25, 2022 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04B1/94
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
The invention provides methods, systems, and devices for installing barriers in openings or gaps in or between structures such as walls, ceilings, and floors. At least one barrier molding bag is positioned in the hole or gap, and a flowable firestop material that is preferably operative to cure or harden, such as a hydratable cementitious slurry, is introduced into the bag to create a barrier in the hole or gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.