Solder-down printed circuit board connection structure
US6783371B2 · kind B2 · utility
9Cited by
18References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2001 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Apr 17, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrical connection structure terminates an electrical signal wire while electrically coupling the wire to a target circuit board. A rigid printed circuit board or flex circuit is attached in a substantially perpendicular orientation to the target board by way of solder. A termination circuit is then mounted near the end of the rigid board or flex circuit that is attached to the target circuit board, with the termination circuit electrically coupling the signal wire with the target circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.