Reducing polymerization stress by controlled segmental curing
US6783810B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2001 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Mar 15, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S522/908
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A photopolymerizable material is exposed to light to effect curing. A portion of the material is exposed to light in a conventional manner, while at least one other portion of the material is masked from direct exposure to the light by use of a mask (10) having at least one mask segment (11) which either completely or at least partially blocks the light. In this manner, the polymerization stress associated with the cured materials is limited or minimized due to extended molecular relaxation promoted by this controlled or hybrid curing technique. Also according to the invention, different segments (30, 31) of a material to be cured (22) are exposed to different wavelengths of light energy (21) or one such segment (30, 31) is exposed to light energy while another such segment is not.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.