Embossed packaging laminate and method of making laminate
US6783823B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2002 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Nov 15, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24149
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A multilayer structure intended for a packaging laminate with embossed appearance comprises a base layer and flexible, deformable layer disposed in planar relationship adjacent one another, with both layers adhesively bonded to one another along part surfaces of the total contact surface of each respective layer in a predetermined pattern. The flexible layer may be permanently deformed along the part surface or part surfaces that are in abutment against, but not adheringly bonded to the base layer, so that it substantially deviates from being in abutment against the base layer. Methods of producing a multilayer structure and a packaging laminate, as well as packaging containers produced from the packaging laminate are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.