Resist ink composition
US6783840B2 · kind B2 · utility
6Cited by
9References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2001 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Oct 30, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a resist ink composition comprising a compound (a) having at least one oxetanyl group and at least one epoxy group within the same molecule and a compound (b) capable of initiating cationic polymerization under irradiation by an active energy ray and/or under heat. This resist ink composition has high photosensitivity and enables the final curing by a brief heating and the cured film exhibits good physical properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.