Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol compound, and process for preparing the same
US6784228B2 · kind B2 · utility
37Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2002 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Sep 5, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/245
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to an epoxy resin composition a cure article thereof, a novel epoxy resin used therein, a polyhydric phenol compound suited for used as an intermediate thereof, and a process for preparing the same. One of the objects to be achieved by the present invention is to exert the heat resistance, the moisture resistance, the dielectric performances and the flame-resistant effect required of electric or electronic materials such as semiconductor encapsulating materials and varnishes for circuit boards in the epoxy resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.