Patent · US Expired

Apparatus and method for the design and manufacture of foldable integrated device array stiffeners

US6784359B2 · kind B2 · utility

33Cited by
7References
69Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 4, 2002
Grant dateAug 31, 2004
Priority date
Expiry dateMar 4, 2022

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T403/32409
  • WIPO fieldTransport
  • WIPO sectorMechanical engineering

Abstract

The present invention relates to an apparatus and method for the design and manufacture of foldable integrated stiffeners. These stiffeners may be used in, for example, thin-film arrays of electrochemical devices.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.