Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes
US6784555B2 · kind B2 · utility
17Cited by
26References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 17, 2001 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Dec 2, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Die attach adhesives and methods for their use, along with the devices that are obtained by the use of the methods. Using semiconductor chips as an example, the adhesives and the method for using them provides an interface between a chip (die) and the chip support. The method includes creating a space between the chip and the chip support of a given sized opening by using inorganic insulator particles having an average particle size of 1 &mgr;m to 1000 &mgr;m and a major axis to minor axis ratio of about 1.0 to 1.5.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.