Multilayer ceramic device
US6784765B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2003 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Apr 26, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4697
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mulitlayer ceramic device improves device functionality, reduces overall device size and profile, makes manufacturing easier, and improves reliability. A first ceramic layer 1 has a first multilayer circuit pattern 2 electrically connected through via holes 3. A second ceramic layer 2 also has a second multilayer circuit pattern 2 electrically connected through via holes 3. A thermosetting resin sheet 17 is disposed between the first and second ceramic layers. The thermosetting resin sheet has through holes filled with a conductive paste for electrically connecting one of multiple circuit pattern layers in the first ceramic layer with one of multiple circuit pattern layers in the second ceramic layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.