Circuit module
US6785147B2 · kind B2 · utility
10Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2003 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | Jun 23, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0315
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention aims to provide a circuit module that includes a sheet-like solid electrolytic capacitor and reduces an area and volume required for mounting electronic components. In the sheet-like solid electrolytic capacitor, valve metal sheet 11 has dielectric layer 13 and current collector layer 12 formed on the surface thereof, and is packaged by insulators 14 and 15. The circuit module is structured to embed the sheet-like solid electrolytic capacitor in a circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.